Beam Profile Analysis for 3D Imaging and Material Detection

15.07.2020 – 3D Imaging

Recently, trinamiX introduced a novel technology called Beam Profile Analysis to both measure distance and obtain material features from projected laser spots. At the core of the innovation is a new class of algorithms, which provides features derived from the analysis of the two-dimensional intensity distribution of each projected spot. These features correlate with distance and material properties and can be further processed by machine-learning approaches. A Beam Profile Analysis hardware module can be built from components available at scale and consists of a standard CMOS camera and a dot projector.

The main components are the camera and a laser-based dot projector. The camera captures an image of the scene illuminated by the projector. Further processing of the image is performed on mobile, embedded or PC type platforms.

Beam Profile Analysis Hardware Module and projected point grid

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