trinamiX @ 3D Sensing for Consumer Forum: Shaping the future of mobile payment

24.08.2021 - 3D Imaging

What will the future of 3D sensing look like for smartphone users? Will face authentication become the de-facto standard for daily procedures like mobile payment? On September 17, 2021 Yole Développement and CIOE will present the 4th 3D Sensing for Consumer Forum which is dedicated to shed light onto questions as stated above. Dr. Stefan Metz, Director 3D Imaging at trinamiX, is joining the discussion to talk about how the trinamiX patented 3D Imaging solution will shape our future interactions with smart applications.

Stefan Metz / trinamiX at 3D Sensing for Consumer Forum 2021

For the fourth time in a row, Yole Développement and China International Optoelectronic Expo (CIOE) are collaborating to organize their Forum on 3D Sensing for Consumers. As part of the internationally renowned CIOE in Shenzhen, China, it (virtually) invites guests from around the world to network with experts and key players from the industry. The discussion will evolve around current challenges and chances, how “technology continues to empower the 3D sensing consumer industry” – as this year’s forum is titled. Seven experts from different fields of practice are joining this year’s discussion in Shenzhen and online.

How trinamiX technology will enhance the security of future applications

Looking at consumers’ preferred authentication methods in smartphones, biometrics are already at the top of the list. They are often perceived as the most reliable and convenient way to, e.g., unlock phones and authorize payments. At the same time, these sensitive procedures increasingly fall victim to fraud. Criminals are still able to deceive common 2D and 3D face authentication systems, by simply using printed photos and hyperrealistic masks. Hence, the industry continues to raise the bar on security standards that biometric solutions should meet.

trinamiX is dedicated to enhancing sensitive consumer applications with a high need for accuracy and protection. “With our patented technology, Beam Profile Analysis, we add an important layer of security to face authentication,” says Stefan Metz. For the first time in 3D sensing, trinamiX’ patented solution introduces material classification – thus it can reliably protect against prevalent fraud attacks: “Beam Profile Analysis can differentiate materials and reliably detect real skin,” Metz explained. “Our solution is able to verify the facial identity of a smartphone user and simultaneously proof his or her liveness based on skin detection.”

In his contribution to the 4th 3D Sensing for Consumer Forum, Metz will share trinamiX’ vision of “Secure face authentication behind OLED for mobile payment” and explain how it is based on their innovative 3D Imaging solution.

To learn more about trinamiX 3D Imaging Solution and what you might be able to expect from the future of 3D sensing join us on September 17, 2021 by registering here. Due to COVID travel restrictions, both onsite and online registration is possible.

Media contact

Naomi Seibert
Naomi Seibert
+49 151 73060180

Other articles